Metallization

 

Metallization is the formation of metal contacts and interconnects in the manufacturing of semiconductor devices. Thin-film aluminum is the most widely used material for the process. It also said to be the third major ingredient for IC fabrication, with the other two being silicon and SiO2.

 

A layer of aluminum is deposited on the surface and down the via holes. Excess aluminum is etched away after another photolithography process, leaving the intended interconnect pattern. Another layer of dielectric layer of isolation dioxide is deposited in to insulate the first layer of aluminum from the next.