Wafer Mounting And Dicing

 

Wafer Mounting and Dicing are two steps within Die Preparation of a wafer. The wafer is mounted on a plastic tape that is attached to a ring. Wafer mounting is performed right after the wafer is cut into separate dice. The adhesive tape on which the wafer is mounted ensures that the individual dice remain firmly in place during 'dicing', as the process of cutting the wafer is called.

 

Wafer dicing is the separation of the individual silicon chips or integrated circuits on a silicon wafer following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, mechanical sawing (with a Dicing Saw) or by laser cutting.